Probe station with integrated laser cutter with high quality/price ratio with PC or manual control for research and small-scale production with upgradeable DC and RF measurement, capacitance measurement. The LCS-4000 gives you maximum flexibility in semiconductor research, laser trimming, laser contact cutting, failure analysis, marking and laser desurfacing in multilayer structures. Everything is done at the microscopic level

The LCS-4000 is available in both fully manual and semi-automatic modes and can be easily configured for a wide range of applications with a wide range of options.

Station characteristics:

- Testing on plates up to 100 mm. (4")
- Probe arms for DC or RF measurements
- Integrated laser system for precise cutting of contacts and surface layer removal
- Ability to take both DC and RF measurements simultaneously while fitting or removing defects from the instrument
- Seiwa high-resolution microscope with turret objectives
- VXM motorized stage for movement along the XY axes
- Movement range up to 100 x 100 mm.
- Software, software manual
- XY stage movement resolution - ±1.5 µm
- Z movement - 12.7 mm
- Stage flatness ≤ 12.7 µm
- Vacuum holder
- Movement in Theta motorized: from 0° - 360°, ±6°
- Resolution in Theta - 0.01°
- Control with PC and joystick
- software, program manual
- Seiwa high resolution microscope with XY movement - 100 x 100 mm
- Microscope turret with 4 objectives
- Focal length +-25 mm
- Air-cooled Nd:YAG Class IIIb pulsed laser - Pulse
width 3-4 ns at full wavelength
- Pulse width: 1064 nm, 532 nm, 355 nm. Pulse energy (high/low): 1064 nm, 0.5 mJ / 0.15 mJ 532 nm: 0.5 mJ / 0.15 mJ 355 nm: 0.4 mJ / 0.15 mJ Cutoff size:

Min. (100x lens)
1064 nm: 2 x 2 µm
532 nm: 1 x 1 µm
355 nm: 1 x 1 µm
Max. (50x objective) 1064
nm: 50 x 50 µm
532 nm: 40 x 40 µm
355 nm: 30 x 30 µm -
Options and upgrade Options and