Angstrom Engineering Inc. (Canada) - manufactures vacuum sputter deposition, electron beam evaporation, ion-assisted deposition, resistive thermal evaporation and space emulation equipment.
Angstrom Engineering Inc. (Canada) is a rapidly growing and one of the fastest growing technology companies in Canada. The company, founded in 1992, is currently a global player in the vacuum process and research equipment market. Today the company offers equipment for various vacuum film deposition processes, such as magnetron deposition (sputter deposition), electron beam evaporation (electron beam evaporation), ion-assisted deposition, resistive thermal evaporation, as well as space emulation equipment.

Sputter
Deposition

The collision of high-energy particles contained in the plasma emits atoms from the surface of the target material, which condense on the surface of the substrate creating a film on the substrate. Magnetron sputtering processes occur at a higher pressure than in evaporation. Processes can also occur at a shorter atom mean free path. Films obtained by magnetron sputtering have a stoichiometry that better represents the composition of the target material than the composition obtained by evaporation. Definitely, the process has advantages in terms of the level of adhesion of the resulting films due to the higher impact energy of the particles.
The sputtered targets and sources can be of different sizes to optimize the speed, productivity and uniformity of the resulting films.
Angstrom Engineering's magnetron sputtering technology combines the highest quality sputter sources with a gas pressure monitoring and control system.
Angstrom Engineering magnetron sputter source systems can be equipped with RF, DC, pulsed DC or MF electrical. Sources
Specially configured sources make deposition of magnetic materials such as Fe, Ni and Co much easier and support the use of thicker targets.

Systems available to the process: Covap II | Nexdep │ Amod │ Evovac │ Others on request