Resistive thermal evaporation

Resistive thermal evaporation

Resistive thermal evaporation

Angstrom Engineering Inc. (Canada) - manufactures vacuum sputter deposition, electron beam evaporation, ion-assisted deposition, resistive thermal evaporation and space emulation equipment.
Angstrom Engineering Inc. (Canada) is a rapidly growing and one of the fastest growing technology companies in Canada. The company, founded in 1992, is currently a global player in the vacuum process and research equipment market. Today the company offers equipment for various vacuum film deposition processes, such as magnetron deposition (sputter deposition), electron beam evaporation (electron beam evaporation), ion-assisted deposition, resistive thermal evaporation, as well as space emulation equipment. Resistive

Thermal Evaporation


Resistive evaporation is a vacuum deposition process that uses electrical energy to heat a cathode, which in turn heats the deposited material to the point where it evaporates. The process can be carried out in a very high vacuum, which makes it possible to increase the mean free path of the atom and thereby reduce the possibility of contamination of the film. A high deposition rate can be achieved. Lower particle energy can reduce the effect of substrate damage. Angstrom Engineering has developed thin film deposition systems based on this technology that allow the deposition of a wide range of materials including: metals, organic polymers and inorganic polymers. The process can be controlled using QCM (quality control manual),

Systems available for the process: Covap II │ Nexdep │ Amod │ Evovac │ Others on request
 


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