The company offers a wide range of advanced metrology products and solutions for semiconductor, LED, PV, FPD, data storage and MEMS applications. The company has over 25 years of experience in film stress measurement, film adhesion testing, wafer metrology (topography, TTV, BOW, WARP, Total wafer thickness) and electrical characterization (4-point probes). Recent developments include a unique technology for the metrology needs of 3DIC manufacturing. The company has shipped its first rigs for inserts up to 450 mm.